Light emitting apparatus and window

ABSTRACT

A method for manufacturing a window includes preparing a liquid crystal device comprising a support substrate, a first electrode, a liquid crystal layer, and a sacrificial structure. The method further includes removing the sacrificial structure from the liquid crystal device, forming a second electrode disposed on a glass layer, and attaching the liquid crystal device to the second electrode.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a continuation of U.S. application Ser. No. 17/173,718, filed onFeb. 11, 2021, which is a division of U.S. application Ser. No.16/528,220, filed on Jul. 31, 2019 (issued on Mar. 16, 2021 as U.S. Pat.No. 10,948,784), which is a division of Ser. No. 15/654,831, filed onJul. 20, 2017 (issued on Sep. 10, 2019 as U.S. Pat. No. 10,409,116), andclaims priority under 35 U.S.C. § 119 of Korean Patent Application No.10-2016-0163024, filed on Dec. 1, 2016, the entire contents of which arehereby incorporated by reference.

BACKGROUND

The present disclosure herein relates to manufacturing of a liquidcrystal device, and more particularly, to manufacturing of an apparatusincluding a liquid crystal device.

Liquid crystals may be materials that are in a mesophase between crystaland liquid phases. The term ‘liquid crystal’ is derived fromcharacteristics of liquidity of liquid and anisotropy of a crystal.Liquid crystals have order in position and direction in a crystal phase.However, liquid crystals have disorder in position and direction in aliquid phase.

Liquid crystals may be used in a polymer dispersed liquid crystal (PDLC)display device. The PDLC display device may be a device in whichelectric fields are applied to a layer, in which polymers and liquidcrystals are uniformly mixed with each other, to change refractiveindexes of the polymers and the liquid crystals so that light isscattered or transmitted.

SUMMARY

The present disclosure provides a miniaturized light emitting apparatusand a method for manufacturing the same.

The present disclosure also provides a miniaturized window and a methodfor manufacturing the same.

A light emitting apparatus, a method for manufacturing the lightemitting apparatus, and a window are provided. An embodiment of theinventive concept provides a method for manufacturing a light emittingapparatus including: preparing a liquid crystal device including asupport substrate, a first electrode, a liquid crystal layer, and asacrificial structure; separating the sacrificial structure from theliquid crystal layer to expose one surface of the liquid crystal layer;and forming a second electrode on the one surface of the liquid crystallayer.

In an embodiment, the method may further include forming a lightemitting layer on the second electrode.

In an embodiment, the first electrode may be in physical contact withthe liquid crystal layer and the light emitting layer.

In an embodiment, the method may further include forming a thirdelectrode on the light emitting layer.

In an embodiment, the sacrificial structure may include a sacrificiallayer and a sacrificial substrate on the sacrificial layer.

In an embodiment, the separating of the sacrificial structure mayinclude thermally treating the sacrificial structure under a temperaturegreater than a glass transition temperature or melting point of thesacrificial layer.

In an embodiment, the separating of the sacrificial structure may beperformed by a physical method.

In an embodiment, the sacrificial layer may include a polymer, and thesacrificial layer may have a glass transition temperature of about 300°C. to about 700° C.

In an embodiment, the preparing of the liquid crystal device mayinclude: forming a sacrificial layer on a sacrificial substrate; andrubbing a first surface of the sacrificial layer.

In an embodiment, the separating of the sacrificial structure mayinclude: applying electrical fields to the liquid crystal layer; andapplying physical force to the sacrificial structure.

In an embodiment, the preparing of the liquid crystal device mayinclude: providing a precursor between the first electrode and thesacrificial structure to form a precursor layer; and applying heat orlight to the precursor layer to form the liquid crystal layer.

In an embodiment of the inventive concept, a light emitting apparatusincludes: a support substrate; a first electrode on the supportsubstrate; a liquid crystal layer on the first electrode; a secondelectrode disposed on the liquid crystal layer and being in physicalcontact with the liquid crystal layer; and a light emitting devicedisposed on the second electrode and being in physical contact with thesecond electrode.

In an embodiment, the liquid crystal layer may include a polymer and aliquid crystal group within the polymer, and the liquid crystal groupmay include a plurality of liquid crystal molecules.

In an embodiment, the light emitting device may have a first surface bein contact with the second electrode, and the first surface of the lightemitting device may have a curved surface.

In an embodiment, the support substrate, the first electrode, and thesecond electrode may be transparent.

In an embodiment of the inventive concept, a window includes: a glasslayer; a liquid crystal device disposed on the glass layer and includinga support substrate, a first electrode, and a liquid crystal layer,which are stacked; and a second electrode disposed between the glasslayer and the liquid crystal device, wherein the second electrode is inphysical direct contact with the glass layer and the liquid crystallayer.

In an embodiment, the liquid crystal layer may include a polymer andliquid crystal molecules.

BRIEF DESCRIPTION OF THE FIGURES

The accompanying drawings are included to provide a furtherunderstanding of the inventive concept, and are incorporated in andconstitute a part of this specification. The drawings illustrateexemplary embodiments of the inventive concept and, together with thedescription, serve to explain principles of the inventive concept. Inthe drawings:

FIGS. 1A to 1E are cross-sectional views illustrating a method formanufacturing a liquid crystal device according to an embodiment of theinventive concept;

FIGS. 2A and 2B are cross-sectional views illustrating a method formanufacturing a liquid crystal device according to another embodiment ofthe inventive concept;

FIGS. 3A and 3B are cross-sectional views illustrating a method formanufacturing a liquid crystal device according to further anotherembodiment of the inventive concept;

FIG. 4 is a cross-sectional view of a light emitting apparatus accordingto an embodiment of the inventive concept;

FIG. 5 is a cross-sectional view of a light emitting apparatus accordingto another embodiment of the inventive concept; and

FIG. 6 is a cross-sectional view of a window according to an embodimentof the inventive concept.

DETAILED DESCRIPTION

Exemplary embodiments of the present invention will be described withreference to the accompanying drawings so as to sufficiently understandconstitutions and effects of the present invention. The presentinvention may, however, be embodied in different forms and should not beconstrued as limited to the embodiments set forth herein. Rather, theseembodiments are provided so that this disclosure will be thorough andcomplete, and will fully convey the scope of the present invention tothose skilled in the art. Further, the present invention is only definedby scopes of claims. A person with ordinary skill in the technical fieldof the present invention pertains will be understood that the presentinvention can be carried out under any appropriate environments.

In the following description, the technical terms are used only forexplaining a specific exemplary embodiment while not limiting thepresent invention. In this specification, the terms of a singular formmay include plural forms unless specifically mentioned. The meaning of‘comprises’ and/or ‘comprising’ specifies a component, a step, anoperation and/or an element does not exclude other components, steps,operations and/or elements.

In the specification, it will be understood that when a layer (or film)is referred to as being ‘on’ another layer or substrate, it can bedirectly on the other layer or substrate, or intervening layers may alsobe present.

Also, though terms like a first, a second, and a third are used todescribe various regions and layers (or films) in various embodiments ofthe present invention, the regions and the layers are not limited tothese terms. These terms are used only to discriminate one region orlayer (or film) from another region or layer (or film). Therefore, alayer referred to as a first layer in one embodiment can be referred toas a second layer in another embodiment. An embodiment described andexemplified herein includes a complementary embodiment thereof. Likereference numerals refer to like elements throughout.

Unless terms used in embodiments of the present invention aredifferently defined, the terms may be construed as meanings that arecommonly known to a person skilled in the art.

Hereinafter, a liquid crystal device according to the inventive conceptand a method for manufacturing the same will be described.

FIGS. 1A to 1E are cross-sectional views illustrating a method formanufacturing a liquid crystal device according to an embodiment of theinventive concept.

Referring to FIG. 1A, a first electrode 120 may be formed on a supportsubstrate 110 to form an electrode structure 100. The support substrate110 may be transparent. The support substrate 110 may include glass orplastic. The first electrode 120 may include transparent conductiveoxide such as indium tin oxide or indium zinc oxide. For anotherexample, the first electrode 120 may include silver nanowire, carbonnanotube, graphene, poly(3,4-ethylenedioxythiophene):polystyrenesulfonate (PEDOT:PSS), polyaniline, polythiophene, or a combinationthereof.

Referring to FIG. 1B, a sacrificial layer 220 may be formed on asacrificial substrate 210 to form a sacrificial structure 200. Thesacrificial substrate 210 may include glass or plastic. The sacrificiallayer 220 may include a polymer. For example, the sacrificial layer 220may include polyethylene, polypropylene, poly(1-dodecane),poly(3-methyl-1-butene), poly(4-methyl-1-pentene),poly(3,3-dimethyl-1-butene), poly(5-methyl-1-hexene),poly(4,4-dimethyl-1-pentene), poly(vinyl alcohol), poly(vinyl chloride),poly(vinyl t-butyl ether), poly(vinyl n-butyl ether), polystyrene,poly(2-vinylnaphthalene), poly(4-vinylpyridine), poly(methylmethacrylate), poly(ether methacrylate), poly(t-butyl methacrylate),poly(vinyl acetate), Nylon 6, polycarbonate, poly(ethyleneterephthalate), poly(ethylene naphthalate), epoxy, urea, and/or phenolresin. The sacrificial layer 220 may have a glass transition temperatureof about 100° C. to about 150° C. For another example, the sacrificiallayer 220 may have a melting point of about 100° C. to about 150° C. Thesacrificial layer 220 may have a thickness of about 0.005 μm to about 10μm.

Referring to FIG. 1C, a precursor layer 301 may be formed between theelectrode structure 100 and the sacrificial structure 200. Thesacrificial structure 200 may be disposed on the electrode structure100. Here, the sacrificial layer 220 may be vertically spaced apart fromthe first electrode 120. The electrode structure 100 may be formed asillustrated in FIG. 1A. The sacrificial structure 200 may be formed asillustrated in FIG. 1B. A precursor solution may be provided between thefirst electrode 120 and the sacrificial layer 220 to form the precursorlayer 301. The precursor layer 301 may include a monomer 311, liquidcrystal molecules 321, and an initiator (not shown). For example, themonomer 311 may include an acrylic-based monomer, an aromatic-basedmonomer, an acrylonitrile-based monomer, and/or a chloride-basedmonomer. For example, the acrylic-based monomer may includetriethylopropane triacrylate (TMPTA), tri(propylene glycol) diacrylate(TPGDA), penthaerithritol triacrylate (PETA), trimethylolpropaneethoxylate triacrylate(TMPEOTA), methyl methacrylate (MMA), methacrylate(MA), tri(propylene glycol) glycerolate diacrylate (TPGDA),vinylacrylate (VA), ethylene glycol dimethacrylate (EGDA), epoxyacrylate monomer or oligomer, and/or 1,6-hexandiol diacrylate (HAD). Thearomatic-based monomer may include styrene (ST) and/or divinyl benzene(DVB). The acrylonitrile-based monomer may include acrylonitrile (AN).The chloride-based monomer may include vinylidene chloride (VDC) and/orvinylbenzyl chloride (VBC). For another example, the monomer may includevinyl stearate (VS) and/or vinyl propionate (VP). The initiator mayinclude a photoinitiator, a thermal initiator, and/or a redox initiatorusing redox reaction. The photoinitiator may include1-hydroxy-cyclohexyl-phenyl-ketone,2-methyl-1[4-(methylthio)phenyl]-2-morpholinopropane-1-one,2-hydroxy-2-methyl-1-phenyl-propane-1-one, benzophenone,2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1propanone,methylbenzoylformate (MBF), alpha,alpha-dimethoxy-alpha-phenylacetophenone,2-benzyl-2-(dimethylamino)-1-[4-(morpholinyl) phenyl]-1-butanone,diphenyl (2,4,6-trimethylbenzoyl)-phosphine oxide, phenylbis(2,4,6-trimethyl benzoyl phosphine oxide, Irgacure 819),bis(.eta.5-2,4-cyclopentadien-1-yl)bis[2,6-difluoro-3-(1H-pyrrol-1-yl)phenyl]titanium,1-hydroxy-cyclohexylphenyl-ketone (CPA), and/or a combination thereof.The thermal initiator may include benzoyl peroxide (BP), acetyl peroxide(AP), diauryl peroxide (DP), di-tert-butyl peroxide (t-BTP), cumylhydroperoxide (CHP), hydrogen peroxide (HP), potassium peroxide (PP),2,T-azobisisobutyronitrile (AIBN), azocompound, and/or silver alkyls.The redox initiator using the redox reaction may include persulfates(K₂S₂O₈).

Referring to FIG. 1D, heat or light may be applied to the precursorlayer (see reference numeral 301 of FIG. 1C) to form a liquid crystallayer 300. The liquid crystal layer 300 may include a polymer 310 and aliquid crystal group 320. The monomer 311 may be polymerized by the heator light to form the polymer 310. The liquid crystal molecules 321 maybe phase-separated from the polymer 310 to form the liquid crystal group320. The liquid crystal group 320 may be provided in the polymer 310.The liquid crystal group 320 may include the plurality of liquid crystalmolecules 321. The liquid crystal layer 300 may have one surface 300 aand the other surface 300 b, which face each other. The one surface 300a of the liquid crystal layer 300 may face the sacrificial layer 220.

Referring to FIG. 1E, the sacrificial structure 200 may be thermallytreated to be separated from the liquid crystal layer 300. A thermaltreating process of the sacrificial structure 200 may be performed in aseparate process that is different from the formation process of theliquid crystal layer 300, which are described with reference to FIG. 1D.The sacrificial structure 200 may be thermally treated under atemperature that is greater than the glass transition temperature or themelting point of the sacrificial layer 220. For example, the sacrificialstructure 200 may be thermally treated at a temperature of about 100° C.to about 150° C. . The sacrificial layer 220 may be transitioned toglass or melted by the thermal treatment.

Thus, the sacrificial structure 200 may be easily removed from theliquid crystal layer 300. If the sacrificial layer 220 is omitted, theliquid crystal layer 300 may be damaged during the separation of thesacrificial structure 200, or it may be difficult to separate thesacrificial structure 200. The liquid crystal layer 300 may not bedamaged by the sacrificial layer 220 during the separation of thesacrificial layer 220.

The sacrificial substrate 210 and the sacrificial layer 220 may beremoved at the same time or at different times. When the sacrificialstructure 200 is removed, the one surface 300 a of the liquid crystallayer 300 may be exposed. The liquid crystal device 1000 may bemanufactured by the afore-described process. Since the sacrificialstructure 200 is removed, the liquid crystal device 1000 may be thinned.In addition, the liquid crystal device 1000 may be reduced in mass.

FIGS. 2A and 2B are cross-sectional views illustrating a method formanufacturing a liquid crystal device according to another embodiment ofthe inventive concept. Hereinafter, the duplicated descriptions, whichhave been described already, will be omitted.

Referring to FIG. 2A, a liquid crystal layer 300 may be formed betweenan electrode structure 100 and a sacrificial structure 200. Asacrificial layer 220 may be applied to a sacrificial substrate 210 toform the sacrificial structure 200. However, the sacrificial layer 200may have a glass transition temperature of about 300° C. to about 700°C. . The formation of the sacrificial layer 200 may include formation ofan intermediate layer (not shown) by applying a monomer solution to thesacrificial substrate 210 and reaction of materials within theintermediate layer. For example, the reaction may be performed byapplying heat, but is not limited thereto. The reaction within theintermediate layer may be at least a part of polymerization. While thesacrificial layer 200 is formed, stress may be applied to thesacrificial layer 220. The sacrificial layer 220 may have large stress.The stress may be tensile stress. The sacrificial layer 220 may includepolyimide, polyarylate, cyclic olefin copolymer, and/or polynorbornene.The sacrificial layer 220 may have a thickness of about 0.005 μm toabout 10 μm. The liquid crystal layer 300 may be formed as illustratedin FIG. 1C.

Referring to FIG. 2B, the sacrificial structure 200 may be separatedfrom the liquid crystal layer 300 by a physical method to expose onesurface 300 a of the liquid crystal layer 300. Since the sacrificiallayer 220 has large stress, bonding strength between the sacrificiallayer 220 and the sacrificial substrate 210 may be greater than thatbetween the sacrificial layer 220 and the liquid crystal layer 300.

When the sacrificial layer 220 has a glass transition temperature ofabout 300° C. or less, the bonding strength between the sacrificiallayer 220 and the liquid crystal layer 300 may increase. According to anembodiment, since the sacrificial layer 220 has a glass transitiontemperature of about 300° C. or more, the bonding strength between thesacrificial layer 220 and the liquid crystal layer 300 may be reduced.

Since the process of separating the sacrificial layer 220 is performedunder a temperature less than a phase transition temperature of liquidcrystal molecules 321, the bonding strength between the sacrificiallayer 220 and the liquid crystal layer 300 may be further reduced. Forexample, the separation process of the sacrificial layer 220 may beperformed under a temperature of about 110° C. or less. Thus, thesacrificial layer 220 may be easily separated from the liquid crystallayer 300. While the sacrificial layer 220 is separated, the liquidcrystal layer 300 may not be damaged. The liquid crystal device 1000 maybe manufactured according to the example described above.

FIGS. 3A and 3B are cross-sectional views illustrating a method formanufacturing a liquid crystal device according to further anotherembodiment of the inventive concept. Hereinafter, the duplicateddescriptions, which have been described already, will be omitted.

Referring to FIG. 3A, a sacrificial structure 200 may be prepared. Theformation of the sacrificial structure 200 may include formation of asacrificial layer 220 on a sacrificial substrate 210 and rubbing of afirst surface 220 b of the sacrificial layer 220. The sacrificial layer220 may include polyimide, polyvinyl alcohol, silicon oxide, and/orsilicon nitride. The sacrificial layer 220 may have a rubbing axis. Therubbing axis may be parallel to a first direction D 1. The firstdirection D1 may be parallel to a top surface of a support substrate110. A second direction D2 may be parallel to the top surface of thesupport substrate 110 and cross the first direction Dl. For example, thesecond direction D2 may be perpendicular to the first direction Dl.

The sacrificial structure 200 may be disposed to be spaced apart from anelectrode structure 100. The liquid crystal layer 300 may be formedbetween the electrode structure 100 and the sacrificial structure 200.The first surface 220 b of the sacrificial layer 220 may physically comeinto contact with a liquid crystal layer 300. Liquid crystal molecules321 adjacent to the sacrificial layer 220 may have orientation. Forexample, the liquid crystal molecules 321 on one surface 300 a of theliquid crystal layer 300 may have orientation. The liquid crystalmolecules 321 may be orientated parallel to the rubbing axis of thesacrificial layer 200. The liquid crystal molecules 321 may beorientated parallel to the first direction Dl.

Referring to FIG. 3B, the sacrificial structure 200 may be separatedfrom the liquid crystal layer 300 by a physical method to expose onesurface 300 a of the liquid crystal layer 300. Physical force may beapplied to one end of the sacrificial structure 200 to separate thesacrificial structure 200. In view of the plane, the sacrificialstructure 200 may be separated in the second direction D2. For example,after the one end of the sacrificial structure 200 is spaced apart fromthe liquid crystal layer 300, the other end of the sacrificial structure200 may be spaced apart from the liquid crystal layer 300. Here, the oneend and the other end of the sacrificial structure 200 may be adjacentto a first side surface 200 c and a second side surface 200 d of thesacrificial structure 200, respectively. The first and second sidesurfaces 200 c and 200 d of the sacrificial structure 200 may beparallel to the first direction D1. Bonding strength between the liquidcrystal layer 300 and the sacrificial layer 220 when the liquid crystalmolecules 321 are parallel to the first direction D1 may be less thanthat between the liquid crystal layer 300 and the sacrificial layer 220when the liquid crystal molecules 321 are parallel to the seconddirection D2. Thus, the sacrificial layer 220 may be easily separatedfrom the liquid crystal layer 300. In the separation process of thesacrificial layer 220, electrical fields may be more applied to theliquid crystal layer 300. In this case, the orientation of the liquidcrystal molecules 321 may be more improved by the electrical fields. Thesacrificial layer 200 may be more easily separated. The separationprocess of the sacrificial layer 220 may be performed under atemperature less than a phase transition temperature of the liquidcrystal molecules 321. The liquid crystal device 1000 may bemanufactured according to the example described above. After thesacrificial structure 200 is separated, the liquid crystal molecules 321on the one surface 300 a of the liquid crystal layer 300 may be randomlyoriented.

Hereinafter, a light emitting apparatus including a liquid crystaldevice and manufacturing of the light emitting apparatus will bedescribed.

FIG. 4 is a cross-sectional view of a light emitting apparatus accordingto an embodiment of the inventive concept. Hereinafter, the duplicateddescriptions, which have been described already, will be omitted.

Referring to FIG. 4, a light emitting apparatus 1 may include a liquidcrystal device 1000, a second electrode 400, and a light emitting device2000. The liquid crystal device 1000 may include a support substrate110, a first electrode 120, and a liquid crystal layer 300. The lightemitting device 2000 may include a light emitting layer 500 and a thirdelectrode 600. The third electrode 600 may be disposed on the lightemitting layer 500. The light emitting device 2000 may include anorganic light emitting diode device, a field emission display (FED)device, or a plasma display panel (PDP) device. The light emittingdevice 2000 may emit light to the liquid crystal device 1000 through thesecond electrode 400.

The second electrode 400 may be disposed between the liquid crystaldevice 1000 and the light emitting device 2000. The second electrode 400may be in physical contact with the liquid crystal layer 300 and thelight emitting layer 500.

The second electrode 400 may be transparent. The second electrode 400may include transparent conductive oxide such as indium tin oxide orindium zinc oxide. For another example, the second electrode 400 mayinclude silver nanowire, carbon nanotube, graphene,poly(3,4-ethylenedioxythiophene):polystyrene sulfonate (PEDOT:PSS),polyaniline, polythiophene, or a combination thereof. The secondelectrode 400 may function as an electrode of the liquid crystal device1000 and an electrode of the light emitting device 2000. For example,orientation of liquid crystal molecules 321 may be adjusted by a voltagedifference between the first electrode 120 and the second electrode 400.Thus, the liquid crystal layer 300 may be adjusted in transmissivity.Emission of light of the light emitting layer 500 may be determined by avoltage difference between the second electrode 400 and the thirdelectrode 600. The liquid crystal device 1000 and the light emittingdevice 2000 may share the second electrode 400, and thus, an additionalelectrode may not be provided between the liquid crystal device 1000 andthe light emitting device 2000. Thus, the light emitting apparatus 1 maybe miniaturized. Since an additional substrate (for example, thesacrificial substrate (see reference numeral 210 of FIG. 1E) is notdisposed between the liquid crystal device 1000 and the light emittingdevice 2000, the light emitting apparatus 1 may be more miniaturized.

A process of forming the light emitting apparatus 1 may include aprocess of forming a second electrode 400 on a light emitting device2000, a process of preparing a liquid crystal device 1000, and a processof disposing the second electrode 400 on a liquid crystal layer 300. Theliquid crystal device 1000 may be manufactured as the examples describedwith reference to FIGS. 1A to 1E, FIGS. 2A and 2B, or FIGS. 3A and 3B.The second electrode 400 may come into direct contact with the onesurface 300 a of the liquid crystal layer 300. The process of formingthe second electrode 400 on the light emitting device 200 may beperformed before or after the second electrode 400 is disposed on theliquid crystal layer 300.

The light emitting apparatus 1 may be used in various fields such asdisplay apparatuses, lighting fixtures, and/or signboards.

FIG. 5 is a cross-sectional view of a light emitting apparatus accordingto another embodiment of the inventive concept. Hereinafter, theduplicated descriptions, which have been described already, will beomitted.

Referring to FIG. 5, a light emitting apparatus 2 may include a liquidcrystal device 1000, a second electrode 400, and a light emitting device2001. A first surface 2001 a of the light emitting device 2001 has acurved surface. The second electrode 400 may be disposed on the lightemitting device 2001 and be in physical contact with the first surface2001 a of the light emitting device 2001. The second electrode 400 maybe flexible. The second electrode 400 may have a shape corresponding tothat of the first surface 2001 a of the light emitting device 2001. Forexample, a bottom surface 400 b of the second electrode 400 may have acurved surface.

The liquid crystal device 1000 may be disposed on the bottom surface 400b of the second electrode 400. The liquid crystal device 1000 mayinclude a support substrate 110, a first electrode 120, and a liquidcrystal layer 300. One surface 300 a of the liquid crystal layer 300 maybe in physical contact with the second electrode 400. The liquid crystaldevice 1000 may be flexible. A bottom surface 1000 b of the liquidcrystal device 1000 may have a curved surface.

The light emitting apparatus 2 may be formed through substantially thesame method as described with reference to FIG. 4. For example, aprocess of forming the light emitting apparatus 2 may include a processof forming a second electrode 400 on a light emitting device 2001, aprocess of preparing a liquid crystal device 1000, and a process ofdisposing the second electrode 400 on a liquid crystal layer 300 of theliquid crystal device 1000.

Hereinafter, a window including a liquid crystal device andmanufacturing of the window will be described.

FIG. 6 is a cross-sectional view of a window according to an embodimentof the inventive concept. Hereinafter, the duplicated descriptions,which have been described already, will be omitted.

Referring to FIG. 6, a window 3 may include a liquid crystal device1000, a second electrode 400, and a glass layer 3000. The glass layer3000 may be transparent. Light may pass through the glass layer 3000 andthen be incident into the second electrode 400. The second electrode 400may be formed on the glass layer 3000. For example, the second electrode400 may be formed through a deposition process. The second electrode 400may come into direct contact with the glass layer 3000. The secondelectrode 400 may be transparent. Light may pass through the secondelectrode 400 and then be incident into the liquid crystal device 1000.

The liquid crystal device 1000 may be disposed on the glass layer 3000.The liquid crystal device 1000 may be manufactured according to theexample described above. The liquid crystal device 1000 may be attachedto the second electrode 400 so that one surface 300 a of the liquidcrystal layer 300 is in physical direct contact with the secondelectrode 400. The liquid crystal layer 300 may be adjusted intransmissivity by a voltage difference between the first electrode 120and the second electrode 400. According to the embodiments, anadditional substrate may not be disposed between the liquid crystallayer 300 and the glass layer 3000. Therefore, the window 3 may bereduced in thickness.

According to the inventive concept, the sacrificial structure may beremoved to expose one surface of the liquid crystal layer. The lightemitting apparatus or the window may be manufactured by using the liquidcrystal device. The second electrode may be in physical direct contactwith the liquid crystal layer and the light emitting device. The liquidcrystal device and the light emitting device may share the secondelectrode. The light emitting apparatus may be miniaturized. Since anadditional substrate is not provided between the liquid crystal deviceand the light emitting device, the light emitting apparatus may be moreminiaturized.

According to the embodiments, the second electrode may be in physicaldirect contact with the liquid crystal device and the glass layer.Therefore, the window may be miniaturized.

Although the exemplary embodiments of the present invention have beendescribed, it is understood that the present invention should not belimited to these exemplary embodiments but various changes andmodifications can be made without departing from the spirit of theinvention. Furthermore, the appended claims should be appreciated as astep including even another embodiment.

What is claimed is:
 1. A method for manufacturing a window, the methodcomprising: preparing a liquid crystal device comprising a supportsubstrate, a first electrode, a liquid crystal layer, and a sacrificialstructure, which are stacked, the liquid crystal layer being disposedbetween the first electrode and the sacrificial structure; removing thesacrificial structure from the liquid crystal device to expose onesurface of the liquid crystal layer; forming a second electrode disposedon a glass layer; attaching the liquid crystal device to the secondelectrode so that the exposed one surface of the liquid crystal layer isin physical direct contact with a first surface of the second electrode,wherein a second surface of the second electrode is in physical directcontact with the glass layer, and wherein the second surface of thesecond electrode is opposite to the first surface of the secondelectrode.
 2. The method of claim 1, wherein the liquid crystal layercomprises a polymer and a liquid crystal group within the polymer,wherein the liquid crystal group includes a plurality of liquid crystalmolecules, and wherein the plurality of liquid crystal molecules arephase-separated from the polymer.
 3. The method of claim 1, wherein theforming the second electrode includes performing a deposition process.4. The method of claim 1, wherein the sacrificial structure includes asacrificial layer and a sacrificial substrate on the sacrificial layer.5. The method of claim 4, wherein the removing the sacrificial structurecomprises thermally treating the sacrificial structure under atemperature greater than a glass transition temperature or melting pointof the sacrificial layer.
 6. The method of claim 4, wherein thesacrificial layer comprises a polymer, and the glass transitiontemperature of the sacrificial layer ranges from about 300° C. to about700° C.
 7. The method of claim 1, wherein the preparing of the liquidcrystal device includes: providing a precursor between the firstelectrode and the sacrificial structure to form a precursor layer; andapplying heat or light to the precursor layer to form the liquid crystallayer.
 8. The method of claim 1, wherein the preparing of the liquidcrystal device includes: forming a sacrificial layer on a sacrificialsubstrate; and rubbing a first surface of the sacrificial layer.
 9. Themethod of claim 8, wherein the removing of the sacrificial structureincludes: applying electrical fields to the liquid crystal layer; andapplying physical force to the sacrificial structure.
 10. The method ofclaim 1, wherein the attaching the liquid crystal device is performedafter the removing the sacrificial structure.